advanced power p-channel enhancement mode electronics corp. power mosfet lower gate charge bv dss -40v simple drive requirement r ds(on) 40m fast switching characteristic i d -26a rohs compliant description absolute maximum ratings symbol units v ds v v gs v i d @t c =25 a i d @t c =100 a i dm a p d @t c =25 w w/ t stg t j symbol value units rthj-c maximum thermal resistance junction-case 3.2 /w rthj-a 62.5 /w rthj-a maximum thermal resistance junction-ambient 110 /w data and specifications subject to change without notice -55 to 150 linear derating factor 39 -55 to 150 parameter drain-source voltage gate-source voltage continuous drain current, v gs @ 10v thermal data parameter total power dissipation operating junction temperature range storage temperature range continuous drain current, v gs @ 10v -16 pulsed drain current 1 -64 + 25 -26 0.31 halogen-free product ap9563gh/j-hf rating -40 maximum thermal resistance, junction-ambient (pcb mount) 3 200902133 1 g d s g d s to-252(h) g d s to-251(j) the to-252 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as dc/dc converters. the through-hole version (ap9563gj) is available for low-profile applications. advanced power mosfets from apec provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.
ap9563gh/j-hf electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =-250ua -40 - - v r ds(on) static drain-source on-resistance 2 v gs =-10v, i d =-16a - - 40 m ? v gs =-4.5v, i d =-12a - - 60 m ? v gs(th) gate threshold voltage v ds =v gs , i d =-250ua -1 - -3 v g fs forward transconductance v ds =-10v, i d =-12a - 18 - s i dss drain-source leakage current v ds =-40v, v gs =0v - - -1 ua drain-source leakage current (t j =125 o c) v ds =-32v, v gs =0v - - -250 ua i gss gate-source leakage v gs = + 25v, v ds =0v - - + 100 na q g total gate charge 2 i d =-12a - 16 30 nc q gs gate-source charge v ds =-32v - 2.5 - nc q gd gate-drain ("miller") charge v gs =-4.5v - 9 - nc t d(on) turn-on delay time 2 v ds =-20v - 8 - ns t r rise time i d =-12a - 30 - ns t d(off) turn-off delay time r g =3.3 , v gs =-10v - 35 - ns t f fall time r d =1.6 -70- ns c iss input capacitance v gs =0v - 1140 2340 pf c oss output capacitance v ds =-25v - 140 - pf c rss reverse transfer capacitance f=1.0mhz - 135 - pf source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =-12a, v gs =0v - - -1.2 v t rr reverse recovery time 2 i s =-12a, v gs =0v, - 27 - ns q rr reverse recovery charge di/dt=-100a/s - 19 - nc notes: 1.pulse width limited by max. junction temperature. 2.pulse test this product is sensitive to electrostatic discharge, please handle with caution. use of this product as a critical component in life support or other similar systems is not authorized. apec does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. apec reserves the right to make changes without further notice to any products herein to improve reliability, function or design. 3.surface mounted on 1 in 2 copper pad of fr4 board 2
ap9563gh/j-hf fig 1. typical output characteristics fig 2. typical output characteristics fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature fig 5. forward characteristic of fig 6. gate threshold voltage v.s. reverse diode junction temperature 3 0 20 40 60 80 02468 -v ds , drain-to-source voltage (v) -i d , drain current (a) t c =25 o c -10v -7.0v -5.0v -4.5v v g = -3.0 v 0 20 40 60 80 0246810 -v ds , drain-to-source voltage (v) -i d , drain current (a) -10v -7.0v -5.0v -4.5v v g = -3.0 v t c = 150 o c 20 24 28 32 36 246810 -v gs , gate-to-source voltage (v) r ds(on) (m ) i d = -12 a t c =25 0.6 0.8 1.0 1.2 1.4 1.6 1.8 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d =-16a v g =-10v 0.6 0.8 1 1.2 1.4 1.6 1.8 -50 0 50 100 150 t j , junction temperature ( o c) -v gs(th) (v) 0 4 8 12 16 20 0 0.2 0.4 0.6 0.8 1 1.2 1.4 -v sd , source-to-drain voltage (v) -i s (a) t j =25 o c t j =150 o c
ap9563gh/j-hf fig 7. gate charge characteristics fig 8. typical capacitance characteristics fig 9. maximum safe operating area fig 10. effective transient thermal impedance fig 11. switching time waveform fig 12. gate charge waveform 4 t d(on) t r t d(off) t f v ds v gs 10% 90% q v g -4.5v q gs q gd q g charge 0 2 4 6 8 10 12 14 0 10203040 q g , total gate charge (nc) -v gs , gate to source voltage (v) v ds =-32v i d =-12a 100 1000 10000 1 5 9 1317212529 -v ds , drain-to-source voltage (v) c (pf) f =1.0mh z c iss c oss c rss 0.1 1 10 100 0.1 1 10 100 -v ds , drain-to-source voltage (v) -i d (a) t c =25 o c single pulse 100us 1ms 10ms 100ms 1s dc 0.01 0.1 1 0.00001 0.0001 0.001 0.01 0.1 1 t , pulse width (s) normalized thermal response (r thjc ) p dm duty factor = t/t peak t j = p dm x r thjc + t c t t 0.02 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse
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